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Split singularities and the competition between crack penetration and debond at a bimaterial interface

Submitted by Zhen Zhang on

Zhen Zhang and Zhigang Suo

For a crack impinging upon a bimaterial interface at an angle, the singular stress field is a linear superposition of two modes, usually of unequal exponents, either a pair of complex conjugates, or two unequal real numbers. In the latter case, a stronger and a weaker singularity coexist (known as split singularities). We define a dimensionless parameter, called the local mode mixity, to characterize the proportion of the two modes at the length scale where the processes of fracture occur. We show that the weaker singularity can readily affect whether the crack will penetrate, or debond, the interface.

Review Articles on Flexible Electronics

Submitted by Teng Li on

[img_assist|nid=46|title=|desc=|link=url,http://www.materialstoday.com/2006_issues/april.htm|align=right|width=75|height=100]The cover story of the April 2006 issue of Materials Today features Flexible Electronics. This issue also includes two review articles in this emerging field of research. Access to full text articles is free of charge at http://www.materialstoday.com.

Review Article:

Material challenge for flexible organic devices, by Jay Lewis

Review Article:

Organic and polymer transistors for electronics, by Ananth Dodabalapur

Cover Story:

Jet printing flexible displays, by R.A. Street et al.