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a JMPS paper about mechanosensing in cell-substrate interaction

Submitted by heshijie on
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JMPS paper: "Some basic questions o mechanosensing in cell–substrate interaction"

In this paper, a mechanical model of cell-substrate interaction is constructed and discovers the mechanisms of cell sensing  compliance, thinckness and distance. If you are interested, pls see details in the paper.

Thermal analysis of slab

Submitted by bothul on
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Dear All,

I am trying to model a fiber reinforced concrete slab on steel beams. I have applied the load in the first step and applied thermal conditions (convection and radiation) in the second step. The analysis reached 400seconds (tops) ( I was expecting 7000s). I have modeled the structure with solids. Slab tied to the beam.
the analysis was run with Abaqus Standard. I have tried the same model using Explicit but the second step won't even start due to convergence. I tried contact between slab and beam.

Extreme Computing

Submitted by karelmatous on

There have been several discussions on "Extreme Mechanics" in recent weeks and I would like to extend this topic to "Extreme Computing". As we develop materials that are more complex, hierarchical and are spanning multiple spatial scales, we will need computational tools that can describe them well. Fluid dynamics community has long time ago embraced large-scale computing of conservation laws of mass, momentum and energy. In mechanics of materials, large-scale computing is still in infancy.

Recovery of electrical resistance in copper films on PET subjected to a tensile strain

Submitted by Oleksandr Glushko on

For flexible electronics applications it is important to understand the behavior of electrical resistance of metal films on polymer substrates under applied tensile strain. Although the growth of resistance during tensile loading was investigated in a number of research papers, the recovery of resistance during unloading remains virtually unexplored. In this paper, substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate (PET) substrates subjected to a tensile strain with different peak values.

Fundamental discoveries in mechanics in recent decade or so

Submitted by Zhigang Suo on

A previous post, Getting Ready for Extreme Mechanics Letters, contained the following paragraph:

“We seek papers from researchers in all disciplines. Mechanics appeals to talents of all kinds. Good mechanics has long been created by people from many fields, by Galileo, Newton, Maxwell and Faraday, as well as by Watt, Darwin, Wright brothers and Whitesides. People make discoveries in mechanics often when doing something else (e.g., in seeking evidence for the existence of God, in building cathedrals, in flying airplanes, in laying transatlantic telegraph cables, in fabricating microprocessors, in watching cells move, in fracking for gas, in inventing optical tweezers, in creating soft lithography, in developing wearable or implantable electronics). Mechanics discovered in one field invariably finds applications in other fields.”

Here I would like to give several examples of papers published in recent decade or so. I will link each paper to its citations on Google Scholar, so that you can have an overview of the influence of the paper on other researchers.

Constitutive modeling of hyperelastic solids reinforced by spheroidal particles under large deformations

Submitted by rezaavaz on

This paper presents a homogenization-based constitutive model for the mechanical behavior of particle-reinforced elastomers with random microstructures subjected to finite deformations. The model is based on a recently developed homogenization method (Avazmohammadi and Ponte Castaneda 2013; J. Elasticity 112, 1828–1850) for two-phase, hyperelastic composites, and is able to directly account for the shape, orientation, and concentration of the particles.

Abaqus is not reporting any CEEQ in coupled temp-displacement step

Submitted by Soud Choudhury on

Hi all,

I am modeling a simple coupled temp-displecment analysis with the following step information:

** MATERIALS

** 

*Material, name=Material-1

*Conductivity

 1e-06,

*Creep, law=HYPERB

44000., 0.005,   4.2, 45000., 8.314

*Elastic

60000., 0.34

*Expansion, zero=25.

 1.4e-05,

*Plastic

20.,  0.

60., 0.1

** 

** PHYSICAL CONSTANTS

** 

*Physical Constants, absolute zero=-273., universal gas=8.314

** STEP: Step-1