Nanostructured Metals Reveal Their Secret Strengthening Mechanisms
It is well known that metals are hardened by deformation and soften by annealing. How about nanostructured metals? Can we reply on conventional metal-working lore?
Blog posts
EM 397 Term Paper: Stress-Induced Voiding in Dual-Damascene Cu Interconnects
Stress-induced voiding (SIV) is investigated in Cu-based, deep-submicron, dual damascene technology. Two failure modes are revealed by TEM failure analysis. For one mode, voids are formed under the via when the via connects a wide metal lead below it. For the via which is instead under a wide metal line, voids are formed right above the via bottom. The void source results from the supersaturated vacancies which develop when Cu is not properly annealed after electroplating and before being constrained by dielectrics. The driving force comes from the stress built up due to grain growth and the thermal expansion mismatch (CTE) between Cu interconnect and dielectrics. A diffusion model is introduced to investigate the voiding mechanism primarily for the vias connected to wide metal leads.
Max Planck Society: Independent Junior Research Group Leader positions
The Max Planck Society (MPS) aims at promoting young international scientists by enabling them to perform their research (in all fields pursued by the MPS) at a Max Planck Institute of their choice.
The MPS offers Independent Junior Research Group Leader positions (W2; equivalent to associate professor level without tenure) granted for a period of 5 years with the option for prolonging twice for 2 years. The deadline for application is January 10, 2007.
MEMS Doubly Clamped High Sensitivity Mass Detector
After reading the abstract on the resonanting cantilever mass detector, I think this paper might be of interest to some. My colleagues and I wrote this for a MEMS device class we took Fall 2005 at Columbia University while I was an undergraduate. It was a term design project.
Abstract – Micro-electromechanical systems (MEMS) often provide cost effective
MechTube - applied mechanics outreach for children
Hello everyone,
Professor Suo suggested that I share this speculative idea that I once posted on Applied Mechanics News here on iMechanica!
In the future, we would like to reach out to children as early as their elementary school years to get them excited about topics drawn from Applied Mechanics. One approach to this goal takes inspiration from the successful "Le main a la pate", or "hands-in-dough", program in France (http://www.lamap.fr/ ), but extends the idea of hands-on science to take advantage of the internet.
Some dates of iMechanica
- 30 March 2007. At a suggestion of Henry Tan, an RSS feed for comments is added as a button"comment at a glance" on the right side of iMechanica.
- 29 March 2007. An aggregator, "Random readings", is added to the rightside of iMechanica.
- 7 March 2007. Michelle Oyen posted an entry "Making iMechanica a better global forum".
Master of Science in Mechatronic Systems Engineering
Lawrence Technological University has introduced a new master’s degree program in mechatronic systems engineering, a philosophical approach that cuts across multiple scientific disciplines.
Mechatronic systems engineers design enhanced products, systems and manufacturing processes by bringing together knowledge from mechanical engineering, electrical engineering and computer science. Students learn new principles for designing mechanical subsystems to satisfy control requirements.
Intracellular CalciumWaves in Bone Cell Networks Under Single Cell Nanoindentation
In this study, bone cells were successfully cultured into a micropatterned network with dimensions close to that of in vivo osteocyte networks using microcontact printing and self-assembled monolyers (SAMs). The optimal geometric parameters for the formation of these networks were determined in terms of circle diameters and line widths. Bone cells patterned in these networks were also able to form gap junctions with each other, shown by immunofluorescent staining for the gap junction protein connexin 43, as well as the transfer of gap-junction permeable calcein-AM dye.
CFRAC 2007 International Conference on Computational Fracture and Failure of Materials and Structures
If you are interested by the computational aspects of fracture and failure of materials and structures,there is a dedicated conference for you : CFRAC 2007, which will be held in Nantes, France, 11-13 June 2007. It is an thematic conference of the European Community in Computational Methods in Applied Sciences (ECCOMAS). The for abstract is now closed. This conference wil involve a certian number