stiffness

Achieving high damping and stiffness is challenging in common materials because of their inter-dependent scaling. Controlling extreme mechanical waves requires synergistically enhanced damping and stiffness. We demonstrate superior damping and stiffness in vertically aligned carbon nanotube (VACNT) foams that are also independently controllable by exploiting their synthesis-tailored structural hierarchy and structural gradients. They exhibit frequency- and amplitude-dependent responses with dramatically tunable dynamic stiffness while maintaining constant damping.

In the attached paper, we have shown that concomitant bending and stretching, whatever their value, concur to make bending stiffness decrease; moreover, concomitant bending and stretching make the stretching stiffness (or the Young modulus) increase until the applied forces reach a threshold value, then they make it decrease. Said differently, graphene is softer to bend when stretched and bent and harder to stretch when bent and moderately stretched.

Once in a while I have to find the stiffness of a spring that I get from the local hardware shop.  I usually use a formula that can be found in some books on mechanics of materials.

But the assumptions bother me a bit because the springs that I used usually underwent large deformations and I wasn't sure whether the numbers I was using were correct or not.  

To check the formula I compared its predicted k to numbers from Abaqus simulations and found reasonably good results for many situations - but not for soft springs.

I'm doing Mtech project on Finite Element Modeling On Polymer Nanocomposite with Clay Nanofiller.  For that am using ABAQUS software,  so i need some information regarding that ABAQUS software, how to do finite element modeling of nanocomposites with nanofiller and How to prepare a code distrubution in the plate like particales in the polymer matrix with ABAQUS software. So please can any give information.

Atomistic simulations show that organosilicates, used as low-permittivity dielectric materials in advanced integrated circuits, can be made substantially stiffer than amorphous silica, while maintaining a lower mass density. The enhanced stiffness is achieved by incorporating organic cross-links to replace bridging oxygen atoms in the silica network. To elucidate the mechanism responsible for the enhanced stiffness, the conformational changes in the network upon hydrostatic and shear loading are examined.