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“Gentleman of Science” L. Ben Freund passed away

Submitted by L. Roy Xu on
mechanician
fracture mechanics
thin films
dynamic fracture

World-renowned mechanician, Professor Freund at Brown University passed away on October 3, 2024. He was a member of the US National Academy of Sciences/Engineering and made significant contributions to mechanics research and the scientific community. Moreover, Prof. Fruend mentored many outstanding Ph.D. students including Prof. Yang Wei at Zhejiang University and my mentor Prof. Ares Rosakis at the  California Institute of Technology.  His famous works include two books: Dynamic Fracture Mechanics, Thin Film Materials co-authored with Subra Suresh.

1 years PostDoctoral Position - Universities Paris 13 & Paris 7 , Paris, France

Submitted by yann.charles on
job
phase field
fracture
buckling
thin films

A 1 year post Doctoral position is avalaible in France, on computational fractur mechanics. This is a join project between Univ. Paris 13 (LSPM lab), and Paris 7 (ITODYS lab).

The present postdoc subject is focused on the modeling cracking and buckling in thin films and nanostructures on stretchable substrate.

A question regarding applying the boundary conditions in thin film peeling

Submitted by Gouravaraju on
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research
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thin films
adhesion; contact mechanics; bioinspired adhesion; nanolayers; microlayers

Hello all,

As is my understanding that, in analytical models such as "Kendall Peeling Model", when they talk about peeling angle it is the angle at which the peeling force is applied (or am I wrong?). But when it comes to FE analysis, if we displace one end of the film at an angle by applying displacement boundary conditions on that end, the resulting forces are not along the same direction of the displacements. So, I am confused as to how to compare the FE results with that of the analytical models.

Thank you.

Next Indentation workshop (SF2M-GIME) in Liège (Belgium) in september 2018.

Submitted by David MERCIER on
conference
nanoindentation
thin films
multilayer
composite
elasticity
Plasticity
creep

Dear colleagues,

 

We inform you that the next indentation conference from the Groupe Indentation Multi-Echelle (GIME) will be held in Liège (Belgium) on 11-14 September 2018.  The conference gathers every two years, scientists and industrials concerned by the problems of mechanical characterization of surfaces. In 2018, this conference is organized by Belgian scientists: ULg, CRM Group, UCL et UMons. In line with the 2016 edition, we organize two half-days of training on indentation, preceding the 2-day symposium.

 

TMS- 2015 CALL FOR ABSTRACT (Symposium on Advances in Thin Films for Electronics and Photonics)

Submitted by Amit Pandey on
conference
thin films
Multifunctional Materials

Meeting

2015 TMS Annual Meeting & Exhibition

Symposium

Advances
in Thin Films for Electronics and Photonics

Sponsorship

TMS
Functional Materials Division (formerly EMPMD)

TMS: Thin Films and Interfaces Committee

High-temperature tensile behavior of freestanding Au thin films

Submitted by Gi-Dong Sim on
research
thin films
Grain Boundary Sliding
creep
Vlassak group
In situ tension test
High-temperature deformation

In this paper, the mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340°C using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore the flow stress decreases with decreasing film thickness, contravening the usual notion that “smaller is stronger”. This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.

This paper has been accepted by Scripta Materialia.

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