finite element analysis

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Packaging mechanical engineers conduct simulation of electronic packages
to optimize package design for compatibility with assembly processes
and for reliable operation in end user systems such as servers, game
consoles and network switches. Simulation is conducted using commercial
finite element software such as ANSYS or ABAQUS to predict package
component stresses and strains. Simulations are verified by measurements
of warpage and stresses / strains in the packages using Digital image
contrast, strain gages, capacitance meters, etc. Package material
properties such as coefficient of thermal expansion, Poisson ratio and
modulus that are required for simulation are measured using specialized
mechanical equipment. Thus, familiarity with numerical simulation

Hi

Dominique Chapelle and Klaus-Jürgen Bathe

Can you define FEM in one line?

If yes, what would it be? And, in that case, permit me a second question: How?

...Really interested in knowing what the members of this community think (of this matter), if they do...

--Ajit

[E&OE]

The Mechanics of Solids and Structures – Hierarchical Modeling and the Finite Element Solution

Miguel Luiz Bucalem and Klaus-Jürgen Bathe

 Our main objective in this book is to provide a rational, structured and modern framework for the modeling and analysis of engineering structures.

All,

Could anyone recommend courses, online materials or text books that
would be suitable for teaching the finite element method to someone with
a non-engineering background. This request is on behalf of an MD
student wishing to use the FEM for modelling the wrist. We're initially
looking for introductory materials.

Best regards

Lee

The following paper is now online:

Falkingham P.L., Bates K.T., Margetts L. and Manning P.L. (2011) "The
'Goldilocks' effect: Presevational bias in vertebrate track
assemblages", Journal of the Royal Society Interface

See: http://rsif.royalsocietypublishing.org/content/early/2011/01/12/rsif.201...

Authors welcome any comments for future studies!

In Abaqus .inp or Abaqus/CAE, are there mesh generation commands similar to ANSYS commands FILL, NGEN, and EGEN used to geneate nodes (between keypoints) and elements ?

For the most up to date ERRATA, go to http://www.mae.wvu.edu/barbero/feacm/errata_feacm.htm 

Seven finalists and three honorable mentions have been announced for the Twenty-Second Annual Robert J. Melosh Competition for the Best Student Paper in Finite Element Analysis. The seven finalists and their current institutions are:

Marcial Gonzalez, Caltech

Ming-Chen Hsu, University of California San Diego

Alejandro Ortiz, University of California Davis

Jay Oswald, Northwestern University

Rashmi Raghu, Stanford University

Phanish Suryanarayana, Caltech

Finite Element Analysis of Vehicle and Tire has become a very important aspect of a tire design and failure analysis to most Tire companies. Tire modeling with ABAQUS is a very complicated process involving complex materials like hyperelastic rubber and textile reinforcements, large model size, prolonged simulation time and various convergence issues. This white paper intends to help in understanding the challenges in tire analysis and several tips and tricks that makes a difference in the quality of the results and processing time.

Reliability of micro-gears is known to be adversely affected by wear. In this work we report a strategy to predict local wear with the aim of predicting their effective life span. For the prediction of local wear we start from the relevant model experiments, choice of a suitable wear model and identification of the wear coefficient from these experiments. This wear model is then implemented in an efficient finite element based scheme to predict local wear.

We are offering a free size-limited version of the ADINA finite element analysis software widely used for solving linear and nonlinear structural, heat transfer, CFD and multiphysics problems.

To request your free copy please visit:

http://www.adina.com/n900.shtml

Advances in Computational Tire Mechanics Minisymposium at ECCM IV, Paris 201016-21 May 2010, http://www.eccm2010.org/